sfh 4680 sfh 4685 engwinklige led im midled-geh?use (880 nm) narrow beam led in midl ed package (880 nm) lead (pb) free produc t - rohs compliant 2009-03-19 1 sfh 4680 sfh 4685 wesentliche merkmale ? algaas-led ? enger abstrahlwinkel ( 20) ? geringe bauh?he ? als toplooker und si delooker einsetzbar ?sfh 4680: gurtung als toplooker sfh 4685: gurtung als sidelooker anwendungen ? sensorik in der automobiltechnik ? datenbertragung ? fernsteuerrung sicherheitshinweise je nach betriebsart emi ttieren diese bauteile hochkonzentrierte, nicht sichtbare infrarot- strahlung, die gef?hrlich fr das menschliche auge sein kann. produkte, die diese bauteile enthalten, mssen gem?? den sicherheits- richtlinien der iec-normen 60825-1 und 62471 behandelt werden. typ type bestellnummer ordering code strahlst?rkegruppierung 1) ( i f = 100 ma, t p = 20 ms) radiant intensity grouping 1) i e (mw/sr) sfh 4680 sfh 4685 q65110a1570 q65110a1571 10 (typ. 20) 10 (typ. 20) 1) gemessen bei einem raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr features ? algaas-led ? narrow halfangle ( 20) ? low profile component ? usable as top-lookin g and side-looking device ?sfh 4680: taping as toplooker sfh 4685: taping as sidelooker applications ? automotive sensors ? data transmission ? remote controls safety advices depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. products which incorporate these devices have to follow the safety precautions given in iec 60825-1 and iec 62471.
2009-03-19 2 sfh 4680, sfh 4685 grenzwerte maximum ratings bezeichnung parameter symbol symbol wert value einheit unit betriebs- und lagertemperatur operating and storage temperature range t op , t stg ? 40 + 100 c sperrspannung reverse voltage v r 5 v vorw?rtsgleichstrom, t a 60 c forward current i f 100 ma sto?strom, t p = 300 s, d = 0, t a 60 c surge current i fsm 1 a verlustleistung t a = 25 c power dissipation p tot 180 mw w?rmewiderstand sperrschicht - umgebung bei montage auf fr4 platine, padgr??e je 16 mm 2 thermal resistance junction - ambient mounted on pc-board (fr4), padsize 16 mm 2 each w?rmewiderstand sperrschicht - l?tstelle bei montage auf metall-block thermal resistance junc tion - soldering point, mounted on metal block r thja r thjs 340 180 k/w k/w kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol wert value einheit unit wellenl?nge der strahlung wavelength at peak emission i f = 100 ma peak 880 nm spektrale bandbreite bei 50% von i max spectral bandwidth at 50% of i max i f = 100 ma ? 80 nm abstrahlwinkel half angle ? 20 grad deg. aktive chipfl?che active chip area a 0.09 mm 2 abmessungen der aktiven chipfl?che dimension of the active chip area l b l w 0.3 0.3 mm2
sfh 4680, sfh 4685 2009-03-19 3 schaltzeiten, i e von 10% auf 90% und von 90% auf 10%, bei i f = 100 ma, r l = 50 switching times, e from 10% to 90% and from 90% to 10%, i f = 100 ma, r l = 50 t r , t f 0.5 s durchlassspannung forward voltage i f = 100 ma, t p = 20 ms i f = 1 a, t p = 100 s v f v f 1.5 ( < 1.8) 3.0 (< 3.8) v v sperrstrom reverse current v r = 5 v i r not designed for reverse operation a gesamtstrahlungsfluss total radiant flux i f = 100 ma, t p = 20 ms e typ 23 mw temperaturkoeffizient von i e bzw. e , i f = 100 ma temperature coefficient of i e or e , i f = 100 ma tc i ? 0.5 %/k temperaturkoeffizient von v f , i f = 100 ma temperature coefficient of v f , i f = 100 ma tc v ? 2 mv/k temperaturkoeffizient von , i f = 100 ma temperature coefficient of , i f = 100 ma tc + 0.25 nm/k kennwerte ( t a = 25 c) characteristics (cont?d) bezeichnung parameter symbol symbol wert value einheit unit
2009-03-19 4 sfh 4680, sfh 4685 strahlst?rke i e in achsrichtung 1) gemessen bei einem raumwinkel = 0.01 sr radiant intensity i e in axial direction at a solid angle of = 0.01 sr bezeichnung parameter symbol werte values einheit unit -r -s -t strahlst?rke radiant intensity i f = 100 ma, t p = 20 ms i e min i e max 10 20 16 32 25 50 mw/sr mw/sr strahlst?rke radiant intensity i f = 1 a, t p = 100 s i e typ 130 160 240 mw/sr 1) nur eine gruppe in einer verpack ungseinheit (streuung kleiner 2:1) / only one group in one packing unit (variation lower 2:1) abstrahlcharakteristik radiation characteristics i rel = f ( ? ) ohf02432 0? 20? 40? 60? 80? 100? 120? 0.4 0.6 0.8 1.0 100? 90? 80? 70? 60? 50? 0? 10? 20? 30? 40? 0 0.2 0.4 0.6 0.8 1.0 ?
sfh 4680, sfh 4685 2009-03-19 5 relative spectral emission i rel = f ( ) forward current i f = f ( v f ) single pulse, t p = 20 s 0 750 rel ohr00877 800 850 900 950 nm 1000 20 40 60 80 % 100 10 ohr00881 f v -3 -2 10 -1 10 0 10 1 10 0123456v8 a f radiant intensity single pulse, t p = 20 s permissible pulse handling capability i f = f ( ), t a 60 c, duty cycle d = parameter i e i e 100 ma = f ( i f ) 10 ohr00878 e f -3 -2 10 -1 10 0 10 1 10 2 10 0 10 10 1 10 2 10 4 ma e (100ma) 3 10 0.05 2 1 0 -1 -2 -3 -4 -5 10 10 10 10 10 t p 10 10 s 10 0 0.1 0.005 0.02 0.01 d = t t a i f d = i p t f p t ohf02532 0.2 0.5 1 0.2 0.4 0.6 0.8 1.0 1.2 max. permissible forward current i f = f ( t a ), r thja = 340 k/w 40 20 0 0 100 80 60 ?c t i f ma ohf02533 a 10 20 30 40 50 60 70 80 90 110
2009-03-19 6 sfh 4680, sfh 4685 ma?zeichnung package outlines ma?e in mm / dimensions in mm. gurtung / polarit?t und lage verpackungseinheit 2000/rolle, ?180 mm oder 9000/rolle, ?330 mm method of taping / polarity and orientation packing unit 2000/reel, ?180 mm or 9000/reel, ?330 mm ma?e in mm (inch) / dimensions in mm (inch). geh?use / package mid mit klarem silikonverguss / mid casted with clear silicone anschlussbelegung pin configuration pad 1 = anode / anode pad 2 = kathode / cathode ohf02956 (1.2) 2.35 2.15 isolating area metallisation pad 2 pad 1 metallisation (0.8) 1.7 1.5 0.75 0.55 3.3 2.9 metallisation backside silicone area 1) device casted with silicone. 1) avoid mechanical stress on silicone surface. 0.75 0.55 0.42 0.42 0.53 0.83 0.83 0.53 ohay2430 2.3 (0.091) 8 (0.315) 4 (0.157) 3.3 (0.130) 0.15 (0.006) 0.15 (0.006) 0.3 (0.012) 0.02 (0.001) 0.05 (0.002) 2.45 (0.096) 3.25 (0.128) 0.05 (0.002) 2? 0.05 (0.002) 2 (0.079) 1.7 (0.067) 0.05 (0.002) 0.05 (0.002) 3.5 (0.138) 0.05 (0.002) 1.75 (0.069) 1.5 (0.059) +0.1 (0.004) pad 1 orientation optical axis/viewing direction
sfh 4680, sfh 4685 2009-03-19 7 empfohlenes l?tpaddesign recommended solder pad design ma?e in mm / dimensions in mm. verarbeitungshinweis: das geh?use ist mit sili kon vergossen. mechan ischer stress auf der bauteiloberfl?che sollte so gering wie m?glich gehalten werden. handling indication: the package is casted with silicone. mechanical stress at the surface of the unit should be as low as possible. ohf02422 4.0 2.4 1.35 padgeometrie fr heat dissipation l?tstopplack solder resist verbesserte w?rmeableitung paddesign for improved cu-fl?che > 16 mm cu-area 2 sfh 4680 4.5 1.7 1.25 verbesserte w?rmeableitung ohf02421 solder resist cu-fl?che > 16 mm paddesign for improved l?tstopplack heat dissipation padgeometrie fr cu-area 2 sfh 4685
2009-03-19 8 sfh 4680, sfh 4685 l?tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 reflow l?tprofil fr bleifreies l?ten (nach j-std-020c) reflow soldering profile for lead free soldering (acc. to j-std-020c ) published by osram opto semico nductors gmbh wernerwerkstrasse 2, d-93049 regensburg www.osram-os.com ? all rights reserved. the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserv ed. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. packing please use the recycling operators known to you. we can also help you ? get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of tr ansport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or system s must be expressly authorized for such purpose! critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support de vice or system, or to affect its safety or effectiveness of that device or system. 2 life support devices or systems are intended (a) to be impl anted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. ohla0687 0 0 t t ?c s 120 s max 50 100 150 200 250 300 ramp up 100 s max 50 100 150 200 250 300 ramp down 6 k/s (max) 3 k/s (max) 25 ?c 30 s max 260 ?c +0 ?c -5 ?c 245 ?c 5 ?c 240 ?c 255 ?c 217 ?c maximum solder profile recommended solder profile 235 ?c -0 ?c +5 ?c minimum solder profile 10 s min
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